- 產(chǎn)品詳情
Introduction and features:
This equipment is developed for the bonding of multi-layer boards. In order to improve efficiency, yield and accuracy, a fully automatic bonding method is adopted. ; This equipment includes: automatic board placement, cleaning, laminating, fast pressing, CCD cutting machine, board collection, spacer paper and other processes, greatly reducing labor and land occupation, water and electricity. Mainly used in: three-layer boards, four-layer boards, five-layer boards and more.
Advantage:
? Fully automatic lamination.
? Cleaning function.
? Improve yield.
? Improve accuracy.
? Connect to MES system.
? Can realize scanning retrospective.
? It can realize AGV docking.
? CP can be calculated automatically
Basic specifications of the machine:
electricity demand | AC220V/3P 60HZ / 20KW |
Maximum machine size | 6000mm(L) ×2900mm(W) × 2300mm(H) |
Working height | 950mm-1100mm |
Pneumatic pressure | 6kg/cm2, consumption 2000/min; |
Machine weight | 10000 ㎏ (MAX); |
Applicable product specifications | 260mm *500 mm or 520mm*630mm |
* Equipment design and specifications can be adjusted to improve equipment performance.